Electronic chemicals

Its scientific name is tetramethylammonium hydroxide (TMAH), which is an alkaline aqueous solution mainly used to develop photoresist layers, dissolving the uncured photoresist after exposure to form precise micro-lithographic patterns.

The scientific name is photosensitive polymer, and common types include poly(methyl methacrylate) (PMMA) and diazonaphthoquinone-novolac (DNQ-Novolac). These materials undergo chemical changes when exposed to light and are used to form patterns in semiconductor manufacturing processes.

Commonly known as hydrofluoric acid (HF) or phosphoric acid (H₃PO₄), different types of etching solutions are selected depending on the etching material. Wet etching is mainly used to remove silicon dioxide or silicon nitride that is not protected by photoresist in order to precisely shape the circuit structure.

Its scientific name is hexamethyldisilazane (HMDS), which is mainly used to improve the adhesion between photoresist and the wafer surface, prevent the photoresist layer from peeling off in subsequent processes, and improve the integrity and reliability of the pattern.

Its common scientific name is propylene glycol monomethyl ether acetate (PGMEA), which is a solvent mainly used to remove excess photoresist at the edge of the wafer to avoid contamination and affect the quality of subsequent processes.

Its scientific name is tetraethyl orthosilicate (TEOS), which is a commonly used precursor used in chemical vapor deposition (CVD) processes to generate silicon dioxide (SiO₂) thin films, providing high uniformity and good dielectric properties, and is widely used in the semiconductor and optoelectronic industries.

Its scientific name is hexamethyldisilazane (HMDS), a surface treatment agent mainly used to improve the adhesion of photoresist to the wafer surface. It can improve the stability of the photoresist layer during the photolithography process, reduce the risk of peeling, and increase the resolution of the lithography pattern.

Its scientific name is Low-Stress Silicon Carbide (Trans-LC), which is a special silicon-carbon material. It is often used to deposit low-stress thin films to reduce mechanical stress in the process and is suitable for high-reliability semiconductor and microelectromechanical systems (MEMS) processes.

Its scientific name is phosphorus oxychloride (POCl₃), a phosphorus-containing chemical substance used as a phosphorus doping source in semiconductor diffusion processes to improve the conductivity of silicon wafers. It is commonly used in N-type doping processes, such as in the manufacture of MOSFETs and solar cells.

Its scientific name is polyimide (PI), a high-performance thermosetting polymer with excellent high-temperature resistance, mechanical strength, electrical insulation, and chemical stability. As a material in semiconductor manufacturing processes, it is often used to create high-temperature stable capping layers, bonding wires, and wire encapsulations, capable of withstanding extreme environments and providing excellent protection.

Its scientific name is polyamide acid (PAA), a precursor material for polyamide. It possesses excellent solubility and is commonly used in the fabrication of photolithography films and other thin-film materials. PAA can be converted into polyamide through heat treatment and is widely used in the manufacture of semiconductors, optoelectronics, and other electronic components due to its good coverage and mechanical properties.

學名：Propylene Glycol Monomethyl Ether (PM)

It is a common organic solvent with low toxicity and high solubility. It is widely used in electronic manufacturing processes for cleaning and removing materials, especially for certain organic and inorganic substances.

學名：Propylene Glycol Monomethyl Ether Acetate (PMA)

It is an ester solvent obtained by reacting propylene glycol monomethyl ether with acetic acid. This solvent has excellent solubility, especially in removing photolithography materials, oil stains, and cleaning electronic components.

學名：Ethylene Glycol Monomethyl Ether (EM)

It is a water-soluble organic solvent, commonly used as a cleaning agent in electronic manufacturing processes. It can dissolve various organic substances and is widely used in thin film processing and photolithography.

學名：Diethylene Glycol Monomethyl Ether (DEM)

It is a medium-polarity solvent, mainly used for cleaning and removing photolithography materials in electronic manufacturing processes, and can be effectively mixed with other solvents to improve its cleaning effect.

學名：Triethylene Glycol Monomethyl Ether (TEM)

It is a low-volatility solvent widely used in cleaning processes in the electronics industry, and is particularly suitable for materials that are not easily soluble, exhibiting good solubility and stability.

學名：Ethylene Glycol Monoethyl Ether (EE)

It is a solvent with strong dissolving properties, often used to remove organic contaminants and residues in electronic manufacturing processes, and has wide applications in thin film deposition and cleaning.

學名：Diethylene Glycol Monoethyl Ether (DE)

It is a medium-polarity solvent suitable for cleaning electronic components, especially effective in removing difficult-to-dissolve substances, and can also be used in electronic packaging processes.

學名：Ethylene Glycol Monobutyl Ether (EB)

It is a low-volatility solvent, commonly used for cleaning photoresists in semiconductor manufacturing processes. It has excellent dissolving properties and is especially suitable for removing grease and dirt.

學名：Diethylene Glycol Monobutyl Ether (DB)

It is a solvent with moderate solubility, commonly used in semiconductor cleaning processes, especially in photolithography and coating processes, where it can effectively remove particles and residues.

學名：Ethylene Glycol Dimethyl Ether (EDM)

It is a low-volatility organic solvent widely used in cleaning and decontamination processes in electronic manufacturing. It has strong solubility and is suitable for thin film processes and the removal of microstructures.

學名：Diethylene Glycol Dimethyl Ether (DEDM)

It is a highly soluble solvent, commonly used in electronic manufacturing processes for cleaning and removing dirt, and is particularly suitable for removing substances with high viscosity and strong adhesion.

學名：Diethylene Glycol Methyl Ethyl Ether (DEMEE)

It is a medium-polarity solvent commonly used for surface cleaning and material removal in electronic manufacturing processes, and is suitable for improving cleaning performance and enhancing the uniformity of thin film processes.

學名：Diethylene Glycol Ethyl Acetate (DCAC)

It is a solvent with strong dissolving properties, mainly used for cleaning and removing photoresists in electronic manufacturing processes. It is highly effective in removing grease, contaminants and residues.

Scientific name: 3-Ethoxypropyl Acetate (EEP)

It is an organic solvent mainly used for cleaning electronic components and process equipment. It has excellent solubility, especially for removing organic dirt and other substances.