Electronic Chemicals

Its scientific name is Tetramethylammonium Hydroxide (TMAH). It is an alkaline aqueous solution mainly used to develop the photoresist layer, dissolve the unhardened photoresist after exposure, and form a precise micro-image pattern.

The scientific name is photosensitive polymer (Photosensitive Polymer), common types include poly(methyl methacrylate), PMMA and diazonaphthoquinone-novolac (DNQ-Novolac). These materials undergo chemical changes when exposed to light and are used to form patterns in semiconductor manufacturing processes.

The common scientific names are hydrofluoric acid (HF) or phosphoric acid (H₃PO₄). Different types of etching solutions are selected according to different etching materials. Wet etching is primarily used to remove silicon dioxide or silicon nitride that is not protected by photoresist to precisely shape circuit structures.

Its scientific name is hexamethyldisilazane (HMDS), which is mainly used to improve the adhesion between the photoresist and the wafer surface, prevent the photoresist layer from peeling off in subsequent processes, and improve the integrity and reliability of the pattern.

Its common scientific name is Propylene Glycol Monomethyl Ether Acetate (PGMEA), which is a solvent mainly used to remove excess photoresist at the edge of the wafer to avoid contamination and affect the quality of subsequent processes.

Its scientific name is Tetraethyl Orthosilicate (TEOS). It is a commonly used precursor used to generate silicon dioxide (SiO₂) thin films in the chemical vapor deposition (CVD) process. It provides high uniformity and good dielectric properties and is widely used in the semiconductor and optoelectronics industries.

Its scientific name is hexamethyldisilazane (HMDS), which is a surface treatment agent mainly used to improve the adhesion between photoresist and wafer surface. It can improve the stability of the photoresist layer during the lithography process, reduce the risk of peeling, and increase the resolution of the lithographic pattern.

The scientific name is Low-Stress Silicon Carbide (Trans-LC), which is a special silicon-carbon material that is often used to deposit low-stress films to reduce mechanical stress in the process. It is suitable for high-reliability semiconductor and micro-electromechanical (MEMS) processes.

Its scientific name is phosphorus oxychloride (POCl₃), which is a phosphorus-containing chemical. It is used as a phosphorus doping source in the semiconductor diffusion process to improve the conductivity of silicon wafers. It is commonly used in N-type doping processes, such as the manufacture of MOSFETs and solar cells.

Its scientific name is polyimide (PI), which is a high-performance thermosetting polymer with excellent high temperature resistance, mechanical strength, electrical insulation and chemical stability. As a material in semiconductor manufacturing, it is often used to make stable covering layers, welding wires, wire packaging, etc. at high temperatures. It can withstand extreme environments and provide excellent protection.

Its scientific name is polyimide (PAA), which is a precursor material of polyimide. It has excellent solubility and is usually used to make photolithography films and other thin film materials. PAA can be converted to polyimide by heat treatment and is widely used in the manufacture of semiconductors, optoelectronics and other electronic components because it provides good coverage and mechanical properties.

學名：Propylene Glycol Monomethyl Ether (PM)

學名：Propylene Glycol Monomethyl Ether Acetate (PMA)

學名：Ethylene Glycol Monomethyl Ether (EM)

學名：Diethylene Glycol Monomethyl Ether (DEM)

學名：Triethylene Glycol Monomethyl Ether (TEM)

學名：Ethylene Glycol Monoethyl Ether (EE)

學名：Diethylene Glycol Monoethyl Ether (DE)

學名：Ethylene Glycol Monobutyl Ether (EB)

學名：Diethylene Glycol Monobutyl Ether (DB)

學名：Ethylene Glycol Dimethyl Ether (EDM)

學名：Diethylene Glycol Dimethyl Ether (DEDM)

學名：Diethylene Glycol Methyl Ethyl Ether (DEMEE)

學名：Diethylene Glycol Ethyl Acetate (DCAC)

Scientific Name: 3-Ethoxypropyl Acetate (EEP)